Our Core Capabilities

We offer a comprehensive suite of assembly services to meet the diverse technical requirements of our global clients:

• SMT (Surface Mount Technology): High-speed automated placement for complex, high-density boards including BGA, QFN, and 01005 components.

• THT (Through-Hole Technology): Precision manual and wave soldering for robust components and power electronics.

• Mixed Assembly: Seamless integration of SMT and Through-Hole components on single or double-sided boards.

• Prototyping & Quick-Turn: Rapid assembly services to accelerate your R&D phase and reduce time-to-market.

• Turnkey Solutions: We manage everything—from component sourcing and PCB fabrication to final assembly and testing.

Quality Assurance & Testing

Quality is at the heart of MITR’s operations. Every board undergoes a multi-stage inspection process to ensure zero-defect delivery:

• AOI (Automated Optical Inspection): Checking for placement accuracy and solder joint integrity.

• X-Ray Inspection: Verifying BGA and hidden solder connections.

• ICT (In-Circuit Testing) & FCT (Functional Testing): Ensuring the board performs exactly to your specifications.

• Visual Inspection: Final human-led QC for aesthetic and structural perfection.